Table of contents
High‐quality In0.47Ga0.53N/GaN heterostructure on Si(111) and its application to MSM detector
L.S. Chuah, Z. Hassan, H. Abu HassanThis paper aims to report on the use of radio frequency nitrogen plasma‐assisted molecular beam epitaxy (RF‐MBE) to grow high‐quality n‐type In0.47Ga0.53N/GaN on Si(111) substrate…
Wire bonding using insulated wire and new challenges in wire bonding
Z.W. ZhongThis paper attempts to review recent advances in wire bonding using insulated wire and new challenges in wire bonding for advanced microelectronics packaging.
Reliability of wirebonds in micro‐electronic packages
W.D. van Driel, R.B.R. van Silfhout, G.Q. ZhangAt present, over 95 percent of the manufactured packages are still being wire bonded. Owing to the ongoing trend of miniaturization, material changes, and cost reduction, wire…
Critical issues, processes and solutions in ISFET packaging
Vinod Kumar KhannaTo provide an insight of the intricacies of ion‐sensitive field‐effect transistor (ISFET) encapsulation and describe the presently available packaging solutions, indicating how…
Experimental and numerical analyses of thick‐film piezoceramic structures for miniaturised sensors and actuators
Marina Santo Zarnik, Darko Belavic, Srecko MacekThe successful use of piezoceramic thick films in sensors and actuators requires a thorough understanding of their electrical and electromechanical characteristics. Since these…
Geometrical, electrical and stability properties of thick‐film and LTCC microcapacitors
Edward Miś, Andrzej Dziedzic, Tomasz Piasecki, Jarosław Kita, Ralf MoosCapacitors are frequently used in electronic circuits. Thick‐film technology allows fabrication of such components in the case of small‐ and medium‐capacitance values. They can…
Micro solid oxide fuel cells and their fabrication methods
Piotr JasinskiThe purpose of this work is to present the strategies and current state of development in the field of micro solid oxide fuel cells (μSOFC).
ISSN:
1356-5362Online date, start – end:
1982Copyright Holder:
Emerald Publishing LimitedOpen Access:
hybridEditor:
- Professor John Atkinson