Table of contents
PAD design reliability for SMD passives
Milos Dusek, Ivan Szendiuch, Petr SzuscikInvestigates the influence of land pattern pad designs and solder volume on reliability of solder joint attachments for surface mounted passive chip devices. All boards were…
An analysis of technology trends within the electronics industry
P.J. Palmer, D.J. WilliamsThis paper begins with a brief review of previous work in the field of technology forecasting and discusses the Fisher Pry model in particular, before concluding with an attempt…
A new method for measuring signal integrity in CMOS ICs
Sonia Delmas‐Bendhia, Fabrice Caignet, Etienne SicardThe aim of this paper is to present a new and original method for on‐chip measurements of very high frequency parasitic signals where a sampling circuit is directly included in…
Cure behavior of a no flow underfill encapsulant
D.T. Hsu, H.K. Kim, F.G. Shi, H.Y. Tong, S. Chungpaiboonpatana, C. Davidson, J.M. AdamsThe curing reaction of a promising “no flow” flip chip underfill encapsulant is investigated by using a differential scanning calorimeter. It is found that the tested underfill…
Reliability of flip chip components soldered on FR5 board
Jarmo Määttänen, Petteri Palm, Aulis TuominenTo achieve good reliability and high performance flip chip interconnection, process parameters and materials used in the flip chip process must be optimised. In this paper…
Substrate integrated packaging for RF‐applications
H. Richter, D. Ferling, F. Buchali, W. HeckIn this paper, Substrate Integrated Packaging (SIP) based on thin film multilayer technology is presented. Coplanar waveguide feedthroughs calculated with 3D‐Finite Differential…
A comparison of routing estimation methods for microelectronic modules
P.A. Sandborn, P. SpletterIt is often necessary to estimate the number of board layers in electronic modules before detailed routing is possible. Several methods for estimating board interconnect…
ISSN:
1356-5362Online date, start – end:
1982Copyright Holder:
Emerald Publishing LimitedOpen Access:
hybridEditor:
- Professor John Atkinson